Official Gazette of the United States Patent and Trademark Office PDF Download

Author: United States. Patent and Trademark Office
Publisher:
ISBN:
Category : Patents
Languages : en
Pages : 1474

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Author: United States. National Aeronautics and Space Administration
Publisher:
ISBN:
Category :
Languages : en
Pages : 792

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Author:
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 476

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Author:
Publisher:
ISBN:
Category : Patents
Languages : en
Pages : 1388

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Author: Lawrence L. Rosine
Publisher: Springer
ISBN: 1489973095
Category : Technology & Engineering
Languages : en
Pages : 463

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Author:
Publisher:
ISBN:
Category : Astronautics
Languages : en
Pages : 794

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Author: Ramses V. Martinez
Publisher: MDPI
ISBN: 3038978280
Category : Technology & Engineering
Languages : en
Pages : 160

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Book Description
Flexible Electronics platforms are increasingly used in the fields of sensors, displays, and energy conversion with the ultimate goal of facilitating their ubiquitous integration in our daily lives. Some of the key advantages associated with flexible electronic platforms are: bendability, lightweight, elastic, conformally shaped, nonbreakable, roll-to-roll manufacturable, and large-area. To realize their full potential, however, it is necessary to develop new methods for the fabrication of multifunctional flexible electronics at a reduced cost and with an increased resistance to mechanical fatigue. Accordingly, this Special Issue seeks to showcase short communications, research papers, and review articles that focus on novel methodological development for the fabrication, and integration of flexible electronics in healthcare, environmental monitoring, displays and human-machine interactivity, robotics, communication and wireless networks, and energy conversion, management, and storage.

Author: John Hu
Publisher: Springer Science & Business Media
ISBN: 1441995269
Category : Technology & Engineering
Languages : en
Pages : 128

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This book will introduce various power management integrated circuits (IC) design techniques to build future energy-efficient “green” electronics. The goal is to achieve high efficiency, which is essential to meet consumers’ growing need for longer battery lives. The focus is to study topologies amiable for full on-chip implementation (few external components) in the mainstream CMOS technology, which will reduce the physical size and the manufacturing cost of the devices.

Author: José Mira
Publisher: Springer Science & Business Media
ISBN: 9783540567981
Category : Computers
Languages : en
Pages : 772

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Neural computation arises from the capacity of nervous tissue to process information and accumulate knowledge in an intelligent manner. Conventional computational machines have encountered enormous difficulties in duplicatingsuch functionalities. This has given rise to the development of Artificial Neural Networks where computation is distributed over a great number of local processing elements with a high degree of connectivityand in which external programming is replaced with supervised and unsupervised learning. The papers presented in this volume are carefully reviewed versions of the talks delivered at the International Workshop on Artificial Neural Networks (IWANN '93) organized by the Universities of Catalonia and the Spanish Open University at Madrid and held at Barcelona, Spain, in June 1993. The 111 papers are organized in seven sections: biological perspectives, mathematical models, learning, self-organizing networks, neural software, hardware implementation, and applications (in five subsections: signal processing and pattern recognition, communications, artificial vision, control and robotics, and other applications).

Author: Gerald L. Ginsberg
Publisher: Springer Science & Business Media
ISBN: 1461535425
Category : Science
Languages : en
Pages : 285

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The last twenty years have seen major advances in the electronics industry. Perhaps the most significant aspect of these advances has been the significant role that electronic equipment plays in almost all product markets. Even though electronic equipment is used in a broad base of applications, many future applications have yet to be conceived. This versatility of electron ics has been brought about primarily by the significant advances that have been made in integrated circuit technology. The electronic product user is rarely aware of the integrated circuits within the equipment. However, the user is often very aware of the size, weight, mod ularity, maintainability, aesthetics, and human interface features of the product. In fact, these are aspects of the products that often are instrumental in deter mining its success or failure in the marketplace. Optimizing these and other product features is the primary role of Electronic Equipment Packaging Technology. As the electronics industry continues to pro vide products that operate faster than their predecessors in a smaller space with a reduced cost per function, the role of electronic packaging technology will assume an even greater role in the development of cost-effective products.