Author: Society of Professional Well Log Analysts. Society of Core AnalystsPublisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
5th Annual Technical Conference
Author: Society of Professional Well Log Analysts. Society of Core AnalystsPublisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
5th Annual Western Technical Conference
Author: Preparing Engineers for National Development in the 21st Century
Author: Association of Professional Engineers of Trinidad and TobagoPublisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
FINAL REPORT OF THE 5TH ANNUAL TECHNICAL CONFERENCE- CIVIL AVIATION SAFETY CENTRE.
Author: AUUGN
Author: Annual Technical Conference Transactions 1972 : Twenty-fifth Annual Technical Conference
Author: Future Energy Conferences and Symposia
Author: Proceedings of the 5th International Young Geotechnical Engineers' Conference
Author: IOS PressPublisher: IOS Press
ISBN: 1614992975
Category : Technology & Engineering
Languages : en
Pages : 624
Book Description
Geotechnical engineers are at work worldwide, contributing to sustainable living and to the creation of safe, economic and pleasant spaces to live, work and relax. With increased pressure on space and resources, particularly in cities, their expertise becomes ever more important. This book presents the proceedings of the 5th iYGEC, International Young Geotechnical Engineers' Conference, held at Marne-la-Vallée, France, from 31 August to 1 September 2013. It is also the second volume in the series Advances in Soil Mechanics and Geotechnical Engineering. The papers included here cover topics such as laboratory and field testing, geology and groundwater, earthworks, soil behavior, constitutive modeling, ground improvement, earthquake, retaining structures, foundations, slope stability, tunnels and observational methods. The iYGEC conference series brings together students and young people at the start of their career in the geotechnical professions to share their experience, and this book will be of interest to all those whose work involves soil mechanics and geotechnical engineering. The cover shows Dieppe harbour breakwater project, Louis-Alexandre de Cessart, 1776-1777. © École Nationale des Ponts et Chaussées.
5th Annual International Electronics Packaging Conference
Author: Publisher:
ISBN:
Category : Electronic packaging
Languages : en
Pages : 627
Book Description
Microstructural Analysis
Author: J. McCallPublisher: Springer Science & Business Media
ISBN: 1461586933
Category : Technology & Engineering
Languages : en
Pages : 344
Book Description
During recent years, people involved in developing new metals and materials for use in some of the rather extreme conditions of stress, temperature, and environment have relied heavily on the microstructural condition of their materials. In fact, many of the newer materials, such as dispersion-strengthened alloys, have been designed almost entirely by first determining the microstruc ture desired and then finding the right combination of composition, heat treatment, and mechanical working that will result in the de sired microstructure. Furthermore, the extremely high reliability required of materials used today, for example, in aerospace and nuclear energy systems, requires close control on the microstruc tural conditions of materials. This is clearly evident from even a cursory examination of recently written specifications for mate rials where rather precise microstructural parameters are stipu lated. Whereas specifications written several years ago may have included microstructural requirements for details such as ASTM grain size or graphite type, today's specifications are beginning to include such things as volume fraction of phases, mean free path of particles, and grain intercept distances. Rather arbitrary terms such as "medium pearlite" have been replaced by requirements such as "interlamella spacing not to exceed 0. 1 micron. " Finally, materials users have become increasingly aware that when a material does fail, the reason for its failure may be found by examining and "reading" its microstructure. The responsibility for a particular microstructure and a resulting failure is a matter of growing importance in current product liability consider ations.