Author: Electronic Components and Technology ConferencePublisher:
ISBN:
Category :
Languages : en
Pages : 68
Book Description
Special Section on 50th Electronic Components and Technology Conference
Author: Electronic Components and Technology ConferencePublisher:
ISBN:
Category :
Languages : en
Pages : 68
Book Description
50th Electronic Components and Technology Conference
Author: Michael F. Caggiano2000 50th Electronic Components and Technology Conference
Author: IEEE Components, Packaging and Manufacturing Technology Society StaffPublisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
50th ECTC
Author: Robert Boudreau2000 Proceedings
Author: Publisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN: 9780780359086
Category : Technology & Engineering
Languages : en
Pages : 1756
Book Description
This work on electronic components and technology covers topics such as advanced packaging, connectors and contacts, interconnections, manufacturing technology, materials and processing, modeling and simulation, and optoelectronics.
2000 Proceedings
Author: Publisher: IEEE Standards Office
ISBN: 9780780359093
Category : Technology & Engineering
Languages : en
Pages : 1756
Book Description
This work on electronic components and technology covers topics such as advanced packaging, connectors and contacts, interconnections, manufacturing technology, materials and processing, modeling and simulation, and optoelectronics.
Advanced Flip Chip Packaging
Author: Ho-Ming TongPublisher: Springer Science & Business Media
ISBN: 1441957685
Category : Technology & Engineering
Languages : en
Pages : 562
Book Description
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Materials for Advanced Packaging
Author: Daniel LuPublisher: Springer
ISBN: 3319450980
Category : Technology & Engineering
Languages : en
Pages : 974
Book Description
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Contributions from the 51st Electronic Components and Technology Conference
Author: Electronic Components and Technology ConferencePublisher:
ISBN:
Category :
Languages : en
Pages : 117
Book Description
Author: