Author: Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages :
Book Description
43rd Electronic Components & Technology Conference 1993
Author: Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages :
Book Description
1993 Proceedings, 43rd Electronic Components & Technology Conference
Author: Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 1166
Book Description
ECTC '93
Author: IEEE, Components, Hybrids and Manufacturing TechnologyPublisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 1160
Book Description
IEEE Electronic Components and Technology Conference, 43rd, 1993
Author: IEEE Components Hybrids & ManufacturingPublisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN: 9780780307940
Category :
Languages : en
Pages : 1166
Book Description
The ECTC offers papers covering a wide spectrum of topics, including not only electronic components, but also exciting new developments in all areas of electronics technology.
IEEE Electronic Components and Technology Conference, 43rd, 1993
Author: Special Section of 28 Papers Selected from Those Presented at the 43rd Electronic Components and Technology Conference (ECTC), Held in Orlando, FL, June 1 - 4, 1993
Author: John H. LauChip On Board
Author: John H. LauPublisher: Springer Science & Business Media
ISBN: 9780442014414
Category : Computers
Languages : en
Pages : 584
Book Description
This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.
Electronic Components and Technology Conference, 1993
Author: Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 1166
Book Description
Optoelectronic Integration: Physics, Technology and Applications
Author: Osamu WadaPublisher: Springer Science & Business Media
ISBN: 1461526868
Category : Technology & Engineering
Languages : en
Pages : 464
Book Description
As we approach the end of the present century, the elementary particles of light (photons) are seen to be competing increasingly with the elementary particles of charge (electrons/holes) in the task of transmitting and processing the insatiable amounts of infonnation needed by society. The massive enhancements in electronic signal processing that have taken place since the discovery of the transistor, elegantly demonstrate how we have learned to make use of the strong interactions that exist between assemblages of electrons and holes, disposed in suitably designed geometries, and replicated on an increasingly fine scale. On the other hand, photons interact extremely weakly amongst themselves and all-photonic active circuit elements, where photons control photons, are presently very difficult to realise, particularly in small volumes. Fortunately rapid developments in the design and understanding of semiconductor injection lasers coupled with newly recognized quantum phenomena, that arise when device dimensions become comparable with electronic wavelengths, have clearly demonstrated how efficient and fast the interaction between electrons and photons can be. This latter situation has therefore provided a strong incentive to devise and study monolithic integrated circuits which involve both electrons and photons in their operation. As chapter I notes, it is barely fifteen years ago since the first demonstration of simple optoelectronic integrated circuits were realised using m-V compound semiconductors; these combined either a laser/driver or photodetector/preamplifier combination.
Manufacturing Aspects in Electronic Packaging 1993
Author: American Society of Mechanical Engineers. Winter MeetingPublisher:
ISBN: 9780791810323
Category : Technology & Engineering
Languages : en
Pages : 144
Book Description