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Author: Lambert E. Feher Publisher: Springer Science & Business Media ISBN: 3540921222 Category : Technology & Engineering Languages : en Pages : 124
Book Description
Many individual technological solutions for microwave applications in industries have been developed without a clear pattern for a key strategy to replace conventional industrial technologies. In this work, the author shows how a modular microwave system line for very homogenous microwave fields is originated. "Energy Efficient Microwave Technologies" is designed for engineers and scientists from industry and academic research. The number of applications of this new technology is enormous: In this book, applications in the avionic field are shown as well as new methods in microwave materials processing for composite materials including new quantum aspects on microwave heating.
Author: Lambert E. Feher Publisher: Springer Science & Business Media ISBN: 3540921222 Category : Technology & Engineering Languages : en Pages : 124
Book Description
Many individual technological solutions for microwave applications in industries have been developed without a clear pattern for a key strategy to replace conventional industrial technologies. In this work, the author shows how a modular microwave system line for very homogenous microwave fields is originated. "Energy Efficient Microwave Technologies" is designed for engineers and scientists from industry and academic research. The number of applications of this new technology is enormous: In this book, applications in the avionic field are shown as well as new methods in microwave materials processing for composite materials including new quantum aspects on microwave heating.
Author: Publisher: Newnes ISBN: 0080932282 Category : Science Languages : en Pages : 3572
Book Description
Semiconductors are at the heart of modern living. Almost everything we do, be it work, travel, communication, or entertainment, all depend on some feature of semiconductor technology. Comprehensive Semiconductor Science and Technology, Six Volume Set captures the breadth of this important field, and presents it in a single source to the large audience who study, make, and exploit semiconductors. Previous attempts at this achievement have been abbreviated, and have omitted important topics. Written and Edited by a truly international team of experts, this work delivers an objective yet cohesive global review of the semiconductor world. The work is divided into three sections. The first section is concerned with the fundamental physics of semiconductors, showing how the electronic features and the lattice dynamics change drastically when systems vary from bulk to a low-dimensional structure and further to a nanometer size. Throughout this section there is an emphasis on the full understanding of the underlying physics. The second section deals largely with the transformation of the conceptual framework of solid state physics into devices and systems which require the growth of extremely high purity, nearly defect-free bulk and epitaxial materials. The last section is devoted to exploitation of the knowledge described in the previous sections to highlight the spectrum of devices we see all around us. Provides a comprehensive global picture of the semiconductor world Each of the work's three sections presents a complete description of one aspect of the whole Written and Edited by a truly international team of experts
Author: Kedar Nath Das Publisher: Springer Nature ISBN: 9811668930 Category : Technology & Engineering Languages : en Pages : 758
Book Description
This book presents the collection of the accepted research papers presented in the 1st ‘International Conference on Computational Intelligence and Sustainable Technologies (ICoCIST-2021)’. This edited book contains the articles related to the themes on artificial intelligence in machine learning, big data analysis, soft computing techniques, pattern recognitions, sustainable infrastructural development, sustainable grid computing and innovative technology for societal development, renewable energy, and innovations in Internet of Things (IoT).
Author: Beth Keser Publisher: John Wiley & Sons ISBN: 1119793890 Category : Technology & Engineering Languages : en Pages : 324
Book Description
Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches. The book begins with a market analysis of the latest technology trends in Fan-Out and Wafer Level Packaging before moving on to a cost analysis of these solutions. The contributors discuss the new package types for advanced application spaces being created by companies like TSMC, Deca Technologies, and ASE Group. Finally, emerging technologies from academia are explored. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces is an indispensable resource for microelectronic package engineers, managers, and decision makers working with OEMs and IDMs. It is also a must-read for professors and graduate students working in microelectronics packaging research.
Author: Mohammad S. Obaidat Publisher: Springer Nature ISBN: 3030904288 Category : Computers Languages : en Pages : 243
Book Description
The present book includes extended and revised versions of a set of selected papers presented at the 17th International Joint Conference on e-Business and Telecommunications, ICETE 2020, held as an online web-based event (due to the COVID-19 pandemic) in July 2020.ICETE 2020 is a joint conference aimed at bringing together researchers, engineers and practitioners interested in information and communication technologies, including data communication networking, e-business, optical communication systems, security and cryptography, signal processing and multimedia applications, and wireless networks and mobile systems.The 10 full papers included in the volume were carefully selected from the 30 submissions accepted to participate in the conference.
Author: Technomic Publisher: CRC Press ISBN: 9781566765527 Category : Technology & Engineering Languages : en Pages : 892
Book Description
This book is a collection of the marketing/technical/regulatory sessions of the Composites Institute's International Composites EXPO '97 held at Nashville, Tennessee on January 27-29, 1997.
Author: Darwin V. Ellis Publisher: Springer Science & Business Media ISBN: 1402037384 Category : Science Languages : en Pages : 697
Book Description
The first edition of this book demystified the process of well log analysis for students, researchers and practitioners. In the two decades since, the industry has changed enormously: technical staffs are smaller, and hydrocarbons are harder to locate, quantify, and produce. New drilling techniques have engendered new measurement devices incorporated into the drilling string. Corporate restructuring and the "graying" of the workforce have caused a scarcity in technical competence involved in the search and exploitation of petroleum. The updated 2nd Edition reviews logging measurement technology developed in the last twenty years, and expands the petrophysical applications of the measurements.
Author: Lambert E. Feher
Author: Lambert E. Feher
Author: Naval Medical Research Institute (U.S.)
Author: 
Author: Kedar Nath Das
Author: 
Author: Beth Keser
Author: Mohammad S. Obaidat
Author: Technomic
Author: Darwin V. Ellis
Author: