Author: Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
Technical Digest 2007
Author: 31st Annual IEEE Compound Semiconductor Integrated Circuit Symposium
Author: Marko Sokolich2015 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS 2015)
Author: IEEE Compound Semiconductor Integrated Circuit SymposiumPublisher:
ISBN: 9781479984930
Category : Compound semiconductors
Languages : en
Pages : 0
Book Description
2011 IEEE Compound Semiconductor Integrated Circuit Symposium
Author: IEEE Electron Devices SocietyPublisher:
ISBN: 9781612847115
Category :
Languages : en
Pages : 234
Book Description
2009 Annual IEEE Compound Semiconductor Integrated Circuit Symposium
Author: Publisher:
ISBN: 9781424452606
Category : Compound semiconductors
Languages : en
Pages : 0
Book Description
2015 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)
Author: IEEE StaffPublisher:
ISBN: 9781479984954
Category :
Languages : en
Pages :
Book Description
CSICS is a technology and integrated circuit conference showcasing many of the finest achievements made in compound semiconductor technology and circuits CSICS has grown to encompass GaAs, InP, GaN, SiGe, SiC, InSb, nano scale CMOS, and graphene semiconductor technologies and their application to RF, mm wave, high speed, and energy conversion circuits and systems Specific technical areas of interest include Innovative device concepts in emerging technologies, Nitrides, InP, III V on Si, Ge on Si, Graphene, Analog, RF, mixed signal, mm wave, THz circuit blocks and ICs in III V, CMOS, SiGe BiCMOS, Power conversion circuits and technologies, Optoelectronic and photonic devices and ICs, System applications, Wireless handsets and base stations, Vehicular and military RADAR, High speed digital systems, Fiber optics and photonics, Device and circuit modeling EM and EDA tools, Thermal simulation and advanced packaging of high power devices and ICs, Device and IC manufacturing processes
Compound Semiconductor Integrated Circuit Symposium, 2009. CISC 2009. Annual IEEE.
Author: Institute of Electrical and Electronics EngineersPublisher:
ISBN: 9781424451913
Category : Components, Circuits, Devices & Systems
Languages : en
Pages :
Book Description
Special section on the IEEE compound semiconductor integrated circuit symposium
Author: 2022 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)
Author: IEEE StaffPublisher:
ISBN: 9781665491334
Category :
Languages : en
Pages : 0
Book Description
The IEEE BiCMOS and Compound semiconductor Integrated Circuits and Technology Symposium (BCICTS) is the forum for developments in bipolar, BiCMOS, and compound semiconductor integrated circuits, devices, and technology Coverage includes all aspects of the technology, from materials, device fabrication, device phenomena, TCAD modeling, compact modeling, integrated circuit design, testing, and system applications A wide range of integrated circuit technologies are covered including bipolar, BiCMOS, SiGe, GaN, GaAs, InP, SiC, and CMOS The latest results in wireless, analog, RF, microwave, high speed digital, mixed signal, optoelectronic, millimeter wave, and THz integrated circuits are embraced
2022 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)
Author: Institute of Electrical and Electronics EngineersPublisher:
ISBN: 9781665491327
Category : Bipolar integrated circuits
Languages : en
Pages : 0
Book Description
The IEEE BiCMOS and Compound semiconductor Integrated Circuits and Technology Symposium (BCICTS) is the forum for developments in bipolar, BiCMOS, and compound semiconductor integrated circuits, devices, and technology Coverage includes all aspects of the technology, from materials, device fabrication, device phenomena, TCAD modeling, compact modeling, integrated circuit design, testing, and system applications A wide range of integrated circuit technologies are covered including bipolar, BiCMOS, SiGe, GaN, GaAs, InP, SiC, and CMOS The latest results in wireless, analog, RF, microwave, high speed digital, mixed signal, optoelectronic, millimeter wave, and THz integrated circuits are embraced.