Author:
Publisher:
ISBN: 9781728135526
Category :
Languages : en
Pages :
Book Description
26th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2019)
26th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2019)
2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Author: IEEE Staff
Publisher:
ISBN: 9781665498166
Category :
Languages : en
Pages : 0
Book Description
The 29th edition of the IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2022) be held in person as a physical conference at the iconic Marina Bay Sands, Singapore from 18 21 July 2022 IPFA will continue to focus on the fundamental understanding of the electrical and physical characterization techniques and associated technologies that assist in probing the nature of wear out and failure in conventional and new CMOS devices, in turn resulting in improved knowhow of the physics of device circuit module failure that serves as critical input for future design for reliability We are also soliciting submissions in new and upcoming research areas including failure analysis for hardware security, reliability and failure analysis of power electronics, photovoltaic technologies, 2D Nanodevices and applications of machine learning and artificial intelligence to the field of failure analysis and reliability assessments
Publisher:
ISBN: 9781665498166
Category :
Languages : en
Pages : 0
Book Description
The 29th edition of the IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2022) be held in person as a physical conference at the iconic Marina Bay Sands, Singapore from 18 21 July 2022 IPFA will continue to focus on the fundamental understanding of the electrical and physical characterization techniques and associated technologies that assist in probing the nature of wear out and failure in conventional and new CMOS devices, in turn resulting in improved knowhow of the physics of device circuit module failure that serves as critical input for future design for reliability We are also soliciting submissions in new and upcoming research areas including failure analysis for hardware security, reliability and failure analysis of power electronics, photovoltaic technologies, 2D Nanodevices and applications of machine learning and artificial intelligence to the field of failure analysis and reliability assessments
24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2017)
2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Author: IEEE Staff
Publisher:
ISBN: 9781467382601
Category :
Languages : en
Pages :
Book Description
IPFA is devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability, yield and performance, especially those related to advanced process technologies
Publisher:
ISBN: 9781467382601
Category :
Languages : en
Pages :
Book Description
IPFA is devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability, yield and performance, especially those related to advanced process technologies
2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Author: IEEE Staff
Publisher:
ISBN: 9781665439893
Category :
Languages : en
Pages :
Book Description
The 28th edition of the IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2021) will be held virtually for a month (with a half day live keynote session) from mid September to mid October IPFA will continue to focus on the fundamental understanding of the electrical and physical characterization techniques and associated technologies that assist in probing the nature of wear out and failure in conventional and new CMOS devices, in turn resulting in improved knowhow of the physics of device circuit module failure that serves as critical input for future design for reliability We are also soliciting submissions in new and upcoming areas of research that include failure analysis for hardware security, reliability and failure analysis of power electronics, photovoltaic technologies as well as 2D Nanodevices and applications of machine learning and artificial intelligence to the field of failure analysis and reliability assessment
Publisher:
ISBN: 9781665439893
Category :
Languages : en
Pages :
Book Description
The 28th edition of the IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2021) will be held virtually for a month (with a half day live keynote session) from mid September to mid October IPFA will continue to focus on the fundamental understanding of the electrical and physical characterization techniques and associated technologies that assist in probing the nature of wear out and failure in conventional and new CMOS devices, in turn resulting in improved knowhow of the physics of device circuit module failure that serves as critical input for future design for reliability We are also soliciting submissions in new and upcoming areas of research that include failure analysis for hardware security, reliability and failure analysis of power electronics, photovoltaic technologies as well as 2D Nanodevices and applications of machine learning and artificial intelligence to the field of failure analysis and reliability assessment
2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Author: IEEE Staff
Publisher:
ISBN: 9781538649305
Category :
Languages : en
Pages :
Book Description
IPFA 2018 is devoted to the fundamental understanding of the electrical and physical characterization techniques and associated technologies that assist in probing the nature of wear out and failure in conventional and new CMOS devices, in turn resulting in improved knowhow of the physics of device circuit module failure that serves as critical input for future design for reliability
Publisher:
ISBN: 9781538649305
Category :
Languages : en
Pages :
Book Description
IPFA 2018 is devoted to the fundamental understanding of the electrical and physical characterization techniques and associated technologies that assist in probing the nature of wear out and failure in conventional and new CMOS devices, in turn resulting in improved knowhow of the physics of device circuit module failure that serves as critical input for future design for reliability
2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Author: IEEE Staff
Publisher:
ISBN: 9781538617809
Category :
Languages : en
Pages :
Book Description
The IPFA will be devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability and yield, especially those related to advanced process technologies
Publisher:
ISBN: 9781538617809
Category :
Languages : en
Pages :
Book Description
The IPFA will be devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability and yield, especially those related to advanced process technologies