Author: Joachim Burghartz Publisher: Springer Science & Business Media ISBN: 1441972765 Category : Technology & Engineering Languages : en Pages : 471
Book Description
Ultra-thin chips are the "smart skin" of a conventional silicon chip. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, Microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, characterization and the applications of ultra-thin chips.
Author: Andreas Herzig Publisher: Springer Nature ISBN: 3030399516 Category : Mathematics Languages : en Pages : 352
Book Description
This book constitutes the refereed proceedings of the 11th International Symposium on Foundations of Information and Knowledge Systems, FoIKS 2020, held in Dortmund, Germany, in February 2020. The 19 revised full papers presented were carefully reviewed and selected from 33 submissions. The papers address various topics such as big data; database design; dynamics of information; information fusion; integrity and constraint management; intelligent agents; knowledge discovery and information retrieval; knowledge representation, reasoning and planning; logics in databases and AI; mathematical foundations; security in information and knowledge systems; semi-structured data and XML; social computing; the semantic web and knowledge management; and the world wide web.
Author: Philipp Cimiano Publisher: Springer ISBN: 3642382886 Category : Computers Languages : en Pages : 753
Book Description
This book constitutes the refereed proceedings of the 10th Extended Semantic Web Conference, ESWC 2013, held in Montpellier, France, in May 2013. The 42 revised full papers presented together with three invited talks were carefully reviewed and selected from 162 submissions. They are organized in tracks on ontologies; linked open data; semantic data management; mobile Web, sensors and semantic streams; reasoning; natural language processing and information retrieval; machine learning; social Web and Web science; cognition and semantic Web; and in-use and industrial tracks. The book also includes 17 PhD papers presented at the PhD Symposium.
Author: G. Ciuprina Publisher: Springer Science & Business Media ISBN: 3540719806 Category : Computers Languages : en Pages : 464
Book Description
This book is a collection of selected papers presented at the last Scientific Computing in Electrical Engineering (SCEE) Conference, held in Sinaia, Romania, in 2006. The series of SCEE conferences aims at addressing mathematical problems which have a relevance to industry, with an emphasis on modeling and numerical simulation of electronic circuits, electromagnetic fields but also coupled problems and general mathematical and computational methods.
Author: Guo Qi Zhang Publisher: Springer Science & Business Media ISBN: 0387755934 Category : Technology & Engineering Languages : en Pages : 338
Book Description
In the past decades, the mainstream of microelectronics progression was mainly powered by Moore's law focusing on IC miniaturization down to nano scale. However, there is a fast increasing need for "More than Moore" (MtM) products and technology that are based upon or derived from silicon technologies, but do not simply scale with Moore’s law. This book provides new vision, strategy and guidance for the future technology and business development of micro/nanoelectronics.
Author: Beth Keser Publisher: John Wiley & Sons ISBN: 1119314135 Category : Technology & Engineering Languages : en Pages : 576
Book Description
Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.
Author: Dirk Koch Publisher: Springer ISBN: 3319264087 Category : Technology & Engineering Languages : en Pages : 331
Book Description
This book makes powerful Field Programmable Gate Array (FPGA) and reconfigurable technology accessible to software engineers by covering different state-of-the-art high-level synthesis approaches (e.g., OpenCL and several C-to-gates compilers). It introduces FPGA technology, its programming model, and how various applications can be implemented on FPGAs without going through low-level hardware design phases. Readers will get a realistic sense for problems that are suited for FPGAs and how to implement them from a software designer’s point of view. The authors demonstrate that FPGAs and their programming model reflect the needs of stream processing problems much better than traditional CPU or GPU architectures, making them well-suited for a wide variety of systems, from embedded systems performing sensor processing to large setups for Big Data number crunching. This book serves as an invaluable tool for software designers and FPGA design engineers who are interested in high design productivity through behavioural synthesis, domain-specific compilation, and FPGA overlays. Introduces FPGA technology to software developers by giving an overview of FPGA programming models and design tools, as well as various application examples; Provides a holistic analysis of the topic and enables developers to tackle the architectural needs for Big Data processing with FPGAs; Explains the reasons for the energy efficiency and performance benefits of FPGA processing; Provides a user-oriented approach and a sense for where and how to apply FPGA technology.
Author: Jesus De Loera Publisher: Springer Science & Business Media ISBN: 3642129714 Category : Mathematics Languages : en Pages : 547
Book Description
Triangulations presents the first comprehensive treatment of the theory of secondary polytopes and related topics. The text discusses the geometric structure behind the algorithms and shows new emerging applications, including hundreds of illustrations, examples, and exercises.
Author: Patrik Haslum Publisher: Morgan & Claypool Publishers ISBN: 1627057374 Category : Computers Languages : en Pages : 189
Book Description
Planning is the branch of Artificial Intelligence (AI) that seeks to automate reasoning about plans, most importantly the reasoning that goes into formulating a plan to achieve a given goal in a given situation. AI planning is model-based: a planning system takes as input a description (or model) of the initial situation, the actions available to change it, and the goal condition to output a plan composed of those actions that will accomplish the goal when executed from the initial situation. The Planning Domain Definition Language (PDDL) is a formal knowledge representation language designed to express planning models. Developed by the planning research community as a means of facilitating systems comparison, it has become a de-facto standard input language of many planning systems, although it is not the only modelling language for planning. Several variants of PDDL have emerged that capture planning problems of different natures and complexities, with a focus on deterministic problems. The purpose of this book is two-fold. First, we present a unified and current account of PDDL, covering the subsets of PDDL that express discrete, numeric, temporal, and hybrid planning. Second, we want to introduce readers to the art of modelling planning problems in this language, through educational examples that demonstrate how PDDL is used to model realistic planning problems. The book is intended for advanced students and researchers in AI who want to dive into the mechanics of AI planning, as well as those who want to be able to use AI planning systems without an in-depth explanation of the algorithms and implementation techniques they use.
Author: Joachim Burghartz
Author: Andreas Herzig
Author: Philipp Cimiano
Author: G. Ciuprina
Author: Guo Qi Zhang
Author: Beth Keser
Author: Dirk Koch
Author: Jesus De Loera
Author: Nino Nanobashvili
Author: Patrik Haslum