Author: Publisher:
ISBN:
Category :
Languages : en
Pages : 0
Book Description
2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
Author: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Author: IEEE StaffPublisher:
ISBN:
Category :
Languages : en
Pages : 0
Book Description
IPFA will continue to focus on the fundamental understanding of the electrical and physical characterization techniques and associated technologies that assist in probing the nature of wear out and failure in conventional and new CMOS devices, in turn resulting in improved know how of the physics of device circuit module failure that serves as critical input for future design for reliability We are also soliciting submissions in new and upcoming research areas including failure analysis for hardware security, reliability and failure analysis of power electronics, photovoltaic technologies, 2D Nano devices and applications of machine learning and artificial intelligence to the field of failure analysis and reliability assessments
Physical and Failure Analysis of Integrated Circuits (IPFA), 2011 18th IEEE International Symposium on the
Author: Physical and Failure Analysis of Integrated Circuits (IPFA), 2012 19th IEEE International Symposium on the
Author: ICAE 2023
Author: Nur Cahyono KushardiantoPublisher: European Alliance for Innovation
ISBN: 1631904434
Category : Technology & Engineering
Languages : en
Pages : 305
Book Description
We are delighted to provide the proceedings of the sixth International Conference on Applied Engineering (ICAE), 2023, which was conducted in Batam on November 7th, 2023. This conference, which has as its theme "Synergizing Green Economy, Sustainable Development, and Digitalization for a Prosperous Future," is a significant international assembly that seeks to integrate technological innovation, economic expansion, and environmental sustainability. An ensemble of stakeholders, comprising policymakers, entrepreneurs, and experts, assembles to examine the mutually beneficial correlation that exists between digital advancements and a green economy. The acceptance rate for ICAE 2023 stands at 25%, leading to the selection of 28 substantial papers. The conference featured three distinct tracks: Informatics, Electronics, and Mechanicals. Two keynote addresses were delivered in conjunction with the outstanding technical paper presentations at the technical program. The keynote addresses were delivered by Dr. Ir. Basuki Rahmatul Alam, Chair of the IEEE EDS Indonesia Chapter and Senior Member of IEEE, and Dr. MK Radhakrishnan, Technical Consultant at NanoRel LLP in Singapore and Vice President of IEEE EDS. Coordination effectiveness with the steering committee was crucial to guaranteeing the conference's success. We wish to convey our profound gratitude for their consistent guidance and support that accompanied the entire undertaking. The ICAE Chair Committee deserves special recognition for their conscientiousness in finalizing the peer-review procedure of technical papers, which ultimately led to the creation of a technical program of exceptional quality. Furthermore, we would like to express our sincere appreciation to the Conference Managers and all the authors who submitted their papers for the ICAE 2023 conference for their invaluable assistance. Additionally, we appreciate the assistance of the EAI staff in facilitating the production of this publication.
Physical and Failure Analysis of Integrated Circuits
Author: IEEE Singapore SectionProceeding of the 15th International Symposium on the Physical & Failure Analysis of Integrated Circuits
Author: Proceedings of the 14th International Symposium on the Physical & Failure Analysis of Integrated Circuits
Author: Souvik MahapatraPublisher: IEEE Computer Society Press
ISBN: 9781424410149
Category : Technology & Engineering
Languages : en
Pages : 309
Book Description
Author: 
Author: IEEE.