Author:
Publisher:
ISBN: 9781728168043
Category :
Languages : en
Pages :
Book Description
2021 IEEE MTT-S International Microwave Filter Workshop (IMFW)
"Microwave Filter Workshop (IMFW), IEEE MTT-S International".
2024 IEEE International Microwave Filter Workshop (IMFW)
Author: IEEE Staff
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 0
Book Description
microwave filter technology
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 0
Book Description
microwave filter technology
2021 IEEE MTT S International Microwave Filter Workshop (IMFW)
Author: IEEE Staff
Publisher:
ISBN: 9781728168050
Category :
Languages : en
Pages :
Book Description
This conference represents a unique and unprecedented opportunity to bring together scientists around the world that works on filters, to share the most recent advances in filter theory, technology and manufacturing After this first event, the conference is supposed to start rotating in different continents Thanks of its topic and location, this conference can represent a good opportunity to have periodic meetings for the filter community, as well as to involve and meet the microwave community around the world that is interested in filters but that have not the possibility of joining IMS
Publisher:
ISBN: 9781728168050
Category :
Languages : en
Pages :
Book Description
This conference represents a unique and unprecedented opportunity to bring together scientists around the world that works on filters, to share the most recent advances in filter theory, technology and manufacturing After this first event, the conference is supposed to start rotating in different continents Thanks of its topic and location, this conference can represent a good opportunity to have periodic meetings for the filter community, as well as to involve and meet the microwave community around the world that is interested in filters but that have not the possibility of joining IMS
Design for Additive Manufacturing
Author: Roland Lachmayer
Publisher: Springer Nature
ISBN: 3662684632
Category :
Languages : en
Pages : 262
Book Description
Publisher: Springer Nature
ISBN: 3662684632
Category :
Languages : en
Pages : 262
Book Description
2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP).
The Proceedings of 2022 International Conference on Wireless Power Transfer (ICWPT2022)
Author: Chengbin Ma
Publisher: Springer Nature
ISBN: 9819906318
Category : Technology & Engineering
Languages : en
Pages : 1213
Book Description
This book includes original, peer-reviewed research papers from the 2022 International Conference on Wireless Power Transfer (ICWPT2022), held in Chongqing, China. The topics covered include but are not limited to: wireless power transfer technology and systems, coupling mechanism and electromagnetic field of wireless power transfer systems, latest developments in wireless power transfer system, and wide applications. The papers share the latest findings in the field of wireless power transfer, making the book a valuable asset for researchers, engineers, university students, etc
Publisher: Springer Nature
ISBN: 9819906318
Category : Technology & Engineering
Languages : en
Pages : 1213
Book Description
This book includes original, peer-reviewed research papers from the 2022 International Conference on Wireless Power Transfer (ICWPT2022), held in Chongqing, China. The topics covered include but are not limited to: wireless power transfer technology and systems, coupling mechanism and electromagnetic field of wireless power transfer systems, latest developments in wireless power transfer system, and wide applications. The papers share the latest findings in the field of wireless power transfer, making the book a valuable asset for researchers, engineers, university students, etc
Special Topics in Information Technology
Author: Francesco Amigoni
Publisher: Springer Nature
ISBN: 3031515005
Category :
Languages : en
Pages : 153
Book Description
Publisher: Springer Nature
ISBN: 3031515005
Category :
Languages : en
Pages : 153
Book Description
Resilient Hybrid Electronics for Extreme/Harsh Environments
Author: Amanda Schrand
Publisher: CRC Press
ISBN: 1003857183
Category : Technology & Engineering
Languages : en
Pages : 187
Book Description
The success of future innovative technology relies upon a community with a shared vision. Here, we present an overview of the latest technological progress in the field of printed electronics for use in harsh or extreme environments. Each chapter unlocksscientific and engineering discoveries that will undoubtedly lead to progression from proof of concept to device creation. The main topics covered in this book include some of the most promising materials, methods, and the ability to integrate printed materials with commercial components to provide the basis for the next generation of electronics that are dubbed “survivable” in environments with high g‐orces, corrosion, vibration, and large temperature fluctuations. A wide variety of materials are discussed that contribute to robust hybrid electronics, including printable conductive composite inks, ceramics and ceramic matrix composites, polymer‐erived ceramics, thin metal films, elastomers, solders and epoxies, to name a few. Collectively, these materials and associated components are used to construct conductive traces, interconnects, antennas, pressure sensors, temperature sensors, power inducting devices, strain sensors and gauges, soft actuators, supercapacitors, piezo ionic elements, resistors, waveguides, filters, electrodes, batteries, various detectors, monitoring devices, transducers, and RF systems and graded dielectric, or graded index (GRIN) structures. New designs that incorporate the electronics as embedded materials into channels, slots and other methods to protect the electronics from the extreme elements of the operational environment are also envisioned to increase their survivability while remaining cognizant of the required frequency of replacement, reapplication and integration of power sources. Lastly, the ability of printer manufacturers, software providers and users to work together to build multi‐axis, multi‐material and commercial‐off‐the‐shelf (COTS) integration into user‐friendly systems will be a great advancement for the field of printed electronics. Therefore, the blueprint for manufacturing resilient hybrid electronics consists of novel designs that exploit the benefits of advances in additive manufacturing that are then efficiently paired with commercially available components to produce devices that exceed known constraints. As a primary example, metals can be deposited onto polymers in a variety of ways, including aerosol jetting, microdispensing, electroplating, sintering, vacuum deposition, supersonic beam cluster deposition, and plasma‐based techniques, to name a few. Taking these scientific discoveries and creatively combining them into robotic, multi‐material factories of the future could be one shared aim of the printed electronics community toward survivable device creation.
Publisher: CRC Press
ISBN: 1003857183
Category : Technology & Engineering
Languages : en
Pages : 187
Book Description
The success of future innovative technology relies upon a community with a shared vision. Here, we present an overview of the latest technological progress in the field of printed electronics for use in harsh or extreme environments. Each chapter unlocksscientific and engineering discoveries that will undoubtedly lead to progression from proof of concept to device creation. The main topics covered in this book include some of the most promising materials, methods, and the ability to integrate printed materials with commercial components to provide the basis for the next generation of electronics that are dubbed “survivable” in environments with high g‐orces, corrosion, vibration, and large temperature fluctuations. A wide variety of materials are discussed that contribute to robust hybrid electronics, including printable conductive composite inks, ceramics and ceramic matrix composites, polymer‐erived ceramics, thin metal films, elastomers, solders and epoxies, to name a few. Collectively, these materials and associated components are used to construct conductive traces, interconnects, antennas, pressure sensors, temperature sensors, power inducting devices, strain sensors and gauges, soft actuators, supercapacitors, piezo ionic elements, resistors, waveguides, filters, electrodes, batteries, various detectors, monitoring devices, transducers, and RF systems and graded dielectric, or graded index (GRIN) structures. New designs that incorporate the electronics as embedded materials into channels, slots and other methods to protect the electronics from the extreme elements of the operational environment are also envisioned to increase their survivability while remaining cognizant of the required frequency of replacement, reapplication and integration of power sources. Lastly, the ability of printer manufacturers, software providers and users to work together to build multi‐axis, multi‐material and commercial‐off‐the‐shelf (COTS) integration into user‐friendly systems will be a great advancement for the field of printed electronics. Therefore, the blueprint for manufacturing resilient hybrid electronics consists of novel designs that exploit the benefits of advances in additive manufacturing that are then efficiently paired with commercially available components to produce devices that exceed known constraints. As a primary example, metals can be deposited onto polymers in a variety of ways, including aerosol jetting, microdispensing, electroplating, sintering, vacuum deposition, supersonic beam cluster deposition, and plasma‐based techniques, to name a few. Taking these scientific discoveries and creatively combining them into robotic, multi‐material factories of the future could be one shared aim of the printed electronics community toward survivable device creation.