Author: Publisher:
ISBN: 9781665404396
Category :
Languages : en
Pages :
Book Description
2021 IEEE International Conference on Sensors and Nanotechnology (SENNANO).
Author: Interconnect Reliability in Advanced Memory Device Packaging
Author: Chong Leong, GanPublisher: Springer Nature
ISBN: 3031267087
Category : Computers
Languages : en
Pages : 223
Book Description
This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects. This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.
2021 IEEE International Conference on Nanoelectronics, Nanophotonics, Nanomaterials, Nanobioscience & Nanotechnology (5NANO).
Author: Proceedings of ASEAN-Australian Engineering Congress (AAEC2022)
Author: Chung Siung ChooPublisher: Springer Nature
ISBN: 9819955475
Category : Technology & Engineering
Languages : en
Pages : 321
Book Description
This book presents the proceedings of the ASEAN-Australian Engineering Congress (AAEC2022), held as a virtual event, 13–15 July 2022 with the theme “Engineering Solutions in the Age of Digital Disruption”. The book presents selected papers covering scientific research in the field of Engineering Computing, Network, Communication and Cybersecurity, Artificial Intelligence & Machine Learning, Materials Science & Manufacturing, Automation and Sensors, Smart Energy & Cities, Simulation & Optimisation and other Industry 4.0 related Technologies. The book appeals to researchers, academics, scientists, students, engineers and practitioners who are interested in the latest developments and applications related to addressing the Fourth Industrial Revolution (IR4.0).
2021 IEEE the 4th International Conference on Nanoscience and Technology (ICNST 2021)
Author: Publisher:
ISBN: 9780738112886
Category : Nanoscience
Languages : en
Pages : 91
Book Description
2021 IEEE 21st International Conference on Nanotechnology (NANO)
Author: IEEE StaffPublisher:
ISBN: 9781665441575
Category :
Languages : en
Pages :
Book Description
Nanofabrication Nanotools Nanomaterials Nanomedicine Nanoenergy Nanoplasmonics Nanoelectronics Nanosensors & Nanoactuators Nanomanufacturing Nanoscale Science Characterization and Modeling Sustainable electronics and abundant nanomaterials from natural sources Bioelectronics Stretchable electronics Healable materials 2D Materials Carbon nanostructures Energy Harvesting, Storage & Management Nanosensors & Actuators Nano enabled Smart Things Neuromorphic Circuits & Architectures Emerging Research Devices & Architectures
2021 IEEE 15th International Conference on Nano/Molecular Medicine & Engineering (NANOMED).
Author: 2021 IEEE 13th International Conference on Humanoid, Nanotechnology, Information Technology, Communication and Control, Environment, and Management (HNICEM)
Author: IEEE StaffPublisher:
ISBN: 9781665401685
Category :
Languages : en
Pages :
Book Description
Robotics, artificial intelligence, and energy
Author: 
Author: