Author: IEEE Staff
Publisher:
ISBN: 9781538649305
Category :
Languages : en
Pages :
Book Description
IPFA 2018 is devoted to the fundamental understanding of the electrical and physical characterization techniques and associated technologies that assist in probing the nature of wear out and failure in conventional and new CMOS devices, in turn resulting in improved knowhow of the physics of device circuit module failure that serves as critical input for future design for reliability
2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Author: IEEE Staff
Publisher:
ISBN: 9781538649305
Category :
Languages : en
Pages :
Book Description
IPFA 2018 is devoted to the fundamental understanding of the electrical and physical characterization techniques and associated technologies that assist in probing the nature of wear out and failure in conventional and new CMOS devices, in turn resulting in improved knowhow of the physics of device circuit module failure that serves as critical input for future design for reliability
Publisher:
ISBN: 9781538649305
Category :
Languages : en
Pages :
Book Description
IPFA 2018 is devoted to the fundamental understanding of the electrical and physical characterization techniques and associated technologies that assist in probing the nature of wear out and failure in conventional and new CMOS devices, in turn resulting in improved knowhow of the physics of device circuit module failure that serves as critical input for future design for reliability
2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2017)
2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Author: IEEE Staff
Publisher:
ISBN: 9781467382601
Category :
Languages : en
Pages :
Book Description
IPFA is devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability, yield and performance, especially those related to advanced process technologies
Publisher:
ISBN: 9781467382601
Category :
Languages : en
Pages :
Book Description
IPFA is devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability, yield and performance, especially those related to advanced process technologies
Proceedings of the 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)
Author: IEEE Staff
Publisher:
ISBN: 9781728135533
Category :
Languages : en
Pages :
Book Description
The IPFA will be devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability and yield, especially those related to advanced process technologies
Publisher:
ISBN: 9781728135533
Category :
Languages : en
Pages :
Book Description
The IPFA will be devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability and yield, especially those related to advanced process technologies
2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Author: IEEE Staff
Publisher:
ISBN: 9781538617809
Category :
Languages : en
Pages :
Book Description
The IPFA will be devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability and yield, especially those related to advanced process technologies
Publisher:
ISBN: 9781538617809
Category :
Languages : en
Pages :
Book Description
The IPFA will be devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability and yield, especially those related to advanced process technologies
2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
ISTFA 2018: Proceedings from the 44th International Symposium for Testing and Failure Analysis
Author:
Publisher: ASM International
ISBN: 1627080996
Category :
Languages : en
Pages :
Book Description
The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.
Publisher: ASM International
ISBN: 1627080996
Category :
Languages : en
Pages :
Book Description
The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.