Author: Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages :
Book Description
24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2017)
Author: 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Author: IEEE StaffPublisher:
ISBN: 9781538617809
Category :
Languages : en
Pages :
Book Description
The IPFA will be devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability and yield, especially those related to advanced process technologies
24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2017)
Author: ISTFA 2018: Proceedings from the 44th International Symposium for Testing and Failure Analysis
Author: Publisher: ASM International
ISBN: 1627080996
Category :
Languages : en
Pages :
Book Description
The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.
Physical and Failure Analysis of Integrated Circuits (IPFA), 2011 18th IEEE International Symposium on the
Author: Proceedings of the ... International Symposium on the Physical & Failure Analysis of Integrated Circuits
Author: Physical and Failure Analysis of Integrated Circuits (IPFA), 2012 19th IEEE International Symposium on the
Author: ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis
Author: Publisher: ASM International
ISBN: 1627082735
Category : Technology & Engineering
Languages : en
Pages : 540
Book Description
The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
Author: 
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