2016 32nd Thermal Measurement, Modeling and Management Symposium (SEMI THERM) PDF Download
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Author: IEEE Staff Publisher: ISBN: 9781509023370 Category : Languages : en Pages :
Book Description
Dedicated topics include 3D electronic packaging, CFD modeling, Data Centers, energy harvesting, high heat flux cooling, LEDs, thermal measurement & characterization, thermal reliability, medical & consumer electronics, and more
Author: IEEE Staff Publisher: ISBN: 9781509023370 Category : Languages : en Pages :
Book Description
Dedicated topics include 3D electronic packaging, CFD modeling, Data Centers, energy harvesting, high heat flux cooling, LEDs, thermal measurement & characterization, thermal reliability, medical & consumer electronics, and more
Author: Márta Rencz Publisher: MDPI ISBN: 303943831X Category : Technology & Engineering Languages : en Pages : 310
Book Description
This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.
Author: Rui Xiong Publisher: MDPI ISBN: 3038425443 Category : Technology & Engineering Languages : en Pages : 427
Book Description
This book is a printed edition of the Special Issue "Advanced Energy Storage Technologies and Their Applications (AESA)" that was published in Energies
Author: Katsuaki Suganuma Publisher: Woodhead Publishing ISBN: 0081020953 Category : Technology & Engineering Languages : en Pages : 242
Book Description
Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration. As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic. Examines the key challenges of wide bandgap power semiconductor packaging at various levels, including materials, components and device performance Provides the latest research on potential solutions, with an eye towards the end goal of system integration Discusses key problems, such as thermal management, noise reduction, challenges in interconnects and substrates
Author: IEEE Staff
Author: IEEE Staff
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Author: Paul Wesling
Author: IEEE Staff
Author: Márta Rencz
Author: 
Author: Rui Xiong
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Author: 
Author: Katsuaki Suganuma