Author: Institute of Electrical and Electronics Engineers (New York, NY). Nanjing SectionPublisher:
ISBN: 9781479904792
Category :
Languages : en
Pages : 773
Book Description
2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Author: Institute of Electrical and Electronics Engineers (New York, NY). Nanjing SectionPublisher:
ISBN: 9781479904792
Category :
Languages : en
Pages : 773
Book Description
Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the
Author: Publisher:
ISBN: 9781479912414
Category : Integrated circuits
Languages : en
Pages :
Book Description
ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis
Author: Publisher: ASM International
ISBN: 1627082735
Category : Technology & Engineering
Languages : en
Pages : 540
Book Description
The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
ISTFA 2017: Proceedings from the 43rd International Symposium for Testing and Failure Analysis
Author: Publisher: ASM International
ISBN: 1627081518
Category : Technology & Engineering
Languages : en
Pages :
Book Description
The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.
ISTFA 2014
Author: A. S. M. InternationalPublisher: ASM International
ISBN: 1627080740
Category : Technology & Engineering
Languages : en
Pages : 561
Book Description
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers address the symposium's theme, Exploring the Many Facets of Failure Analysis.
Proceedings of the 14th International Symposium on the Physical & Failure Analysis of Integrated Circuits
Author: Souvik MahapatraPublisher: IEEE Computer Society Press
ISBN: 9781424410149
Category : Technology & Engineering
Languages : en
Pages : 309
Book Description
Physical and Failure Analysis of Integrated Circuits (IPFA), 2011 18th IEEE International Symposium on the
Author: Proceedings of the 13th International Symposium on the Physical & Failure Analysis of Integrated Circuits
Author: Publisher:
ISBN: 9781509095957
Category : Electronic books
Languages : en
Pages : 363
Book Description
Physical and Failure Analysis of Integrated Circuits (IPFA), 2012 19th IEEE International Symposium on the
Author: ISTFA 2018: Proceedings from the 44th International Symposium for Testing and Failure Analysis
Author: Publisher: ASM International
ISBN: 1627080996
Category :
Languages : en
Pages :
Book Description
The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.