Istfa 2005 PDF Download

Author: ASM International
Publisher: ASM International
ISBN: 1615030883
Category : Technology & Engineering
Languages : en
Pages : 524

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Book Description

Author: Clemens J.M. Lasance
Publisher: Springer Science & Business Media
ISBN: 1461450918
Category : Technology & Engineering
Languages : en
Pages : 550

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Book Description
Thermal Management for LED Applications provides state-of-the-art information on recent developments in thermal management as it relates to LEDs and LED-based systems and their applications. Coverage begins with an overview of the basics of thermal management including thermal design for LEDs, thermal characterization and testing of LEDs, and issues related to failure mechanisms and reliability and performance in harsh environments. Advances and recent developments in thermal management round out the book with discussions on advances in TIMs (thermal interface materials) for LED applications, advances in forced convection cooling of LEDs, and advances in heat sinks for LED assemblies.

Author:
Publisher:
ISBN: 9781479943746
Category :
Languages : en
Pages : 251

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Publisher:
ISBN:
Category :
Languages : en
Pages :

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Book Description

Author: Sadik Kakaç
Publisher: CRC Press
ISBN: 1439849900
Category : Science
Languages : en
Pages : 634

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Book Description
Heat exchangers are essential in a wide range of engineering applications, including power plants, automobiles, airplanes, process and chemical industries, and heating, air conditioning and refrigeration systems. Revised and updated with new problem sets and examples, Heat Exchangers: Selection, Rating, and Thermal Design, Third Edition presents a systematic treatment of the various types of heat exchangers, focusing on selection, thermal-hydraulic design, and rating. Topics discussed include: Classification of heat exchangers according to different criteria Basic design methods for sizing and rating of heat exchangers Single-phase forced convection correlations in channels Pressure drop and pumping power for heat exchangers and their piping circuit Design solutions for heat exchangers subject to fouling Double-pipe heat exchanger design methods Correlations for the design of two-phase flow heat exchangers Thermal design methods and processes for shell-and-tube, compact, and gasketed-plate heat exchangers Thermal design of condensers and evaporators This third edition contains two new chapters. Micro/Nano Heat Transfer explores the thermal design fundamentals for microscale heat exchangers and the enhancement heat transfer for applications to heat exchanger design with nanofluids. It also examines single-phase forced convection correlations as well as flow friction factors for microchannel flows for heat transfer and pumping power calculations. Polymer Heat Exchangers introduces an alternative design option for applications hindered by the operating limitations of metallic heat exchangers. The appendices provide the thermophysical properties of various fluids. Each chapter contains examples illustrating thermal design methods and procedures and relevant nomenclature. End-of-chapter problems enable students to test their assimilation of the material.

Author:
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ISBN:
Category : Amorphous semiconductors
Languages : en
Pages : 392

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Book Description

Author: Franco Sechi
Publisher: Artech House
ISBN: 1596933208
Category : Technology & Engineering
Languages : en
Pages : 333

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Book Description
This practical resource offers expert guidance on the most critical aspects of microwave power amplifier design. This comprehensive book provides descriptions of all the major active devices, discusses large signal characterization, explains all the key circuit design procedures. Moreover you gain keen insight on the link between design parameters and technological implementation, helping you achieve optimal solutions with the most efficient utilization of available technologies. The book covers a broad range of essential topics, from requirements for high-power amplifiers, device models, phase noise and power combiners... to high-efficiency amplifiers, linear amplifier design, bias circuits, and thermal design.

Author: S. M. Sohel Murshed
Publisher: BoD – Books on Demand
ISBN: 9535124056
Category : Computers
Languages : en
Pages : 184

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Book Description
Featuring contributions from the renowned researchers and academicians in the field, this book covers key conventional and emerging cooling techniques and coolants for electronics cooling. It includes following thematic topics: - Cooling approaches and coolants - Boiling and phase change-based technologies - Heat pipes-based cooling - Microchannels cooling systems - Heat loop cooling technology - Nanofluids as coolants - Theoretical development for the junction temperature of package chips. This book is intended to be a reference source and guide to researchers, engineers, postgraduate students, and academicians in the fields of thermal management and cooling technologies as well as for people in the electronics and semiconductors industries.

Author: Gordon N. Ellison
Publisher: CRC Press
ISBN: 1000047466
Category : Technology & Engineering
Languages : en
Pages : 296

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Book Description
The first edition of Thermal Computations for Electronics: Conductive, Radiative, and Convective Air Cooling was based on the author's lecture notes that he developed over the course of nearly 40 years of thermal design and analysis activity, the last 15 years of which included teaching a university course at the senior undergraduate and graduate levels. The subject material was developed from publications of respected researchers and includes topics and methods original to this author. Numerous students have contributed to both the first and second editions, the latter corrected, sections rewritten (e.g., radiation spatial effects, Green's function properties for thermal spreading, 1-D FEA theory and application), and some new material added. The flavor and organization of the first edition have been retained, whereby the reader is guided through the analysis process for systems and then components. Important new material has been added regarding altitude effects on forced and buoyancy driven airflow and heat transfer. The first 20% of the book is devoted to the prediction of airflow and well-mixed air temperatures in systems, circuit board channels, and heat sinks, followed by convective (PCB-mounted components included), radiative, and conductive heat transfer and the resultant temperatures in electronic equipment. Detailed application examples illustrate a variety of problems. Downloads (from the CRC website) include: MathcadTM text examples, exercise solutions (adopting professors only) plus PDF lecture aids (professors only), and a tutorial (Chapter 14) using free FEA software to solve a thermal spreading problem. This book is a valuable professional resource for self-study and is ideal for use in a course on electronics cooling. It is well-suited for a first course in heat transfer where applications are as important as theory.

Author: Muhannad S. Bakir
Publisher: Artech House
ISBN: 1596932473
Category : Technology & Engineering
Languages : en
Pages : 551

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Book Description
This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.