2000 50th Electronic Components and Technology Conference PDF Download

Author: IEEE Components, Packaging and Manufacturing Technology Society Staff
Publisher:
ISBN:
Category :
Languages : en
Pages :

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Book Description

Author:
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN: 9780780359086
Category : Technology & Engineering
Languages : en
Pages : 1756

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Book Description
This work on electronic components and technology covers topics such as advanced packaging, connectors and contacts, interconnections, manufacturing technology, materials and processing, modeling and simulation, and optoelectronics.

Author:
Publisher: IEEE Standards Office
ISBN: 9780780359093
Category : Technology & Engineering
Languages : en
Pages : 1756

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Book Description
This work on electronic components and technology covers topics such as advanced packaging, connectors and contacts, interconnections, manufacturing technology, materials and processing, modeling and simulation, and optoelectronics.

Author: Michael F. Caggiano
Publisher:
ISBN:
Category :
Languages : en
Pages : 24

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Book Description

Author: Daniel Lu
Publisher: Springer
ISBN: 3319450980
Category : Technology & Engineering
Languages : en
Pages : 974

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Book Description
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Author: Ho-Ming Tong
Publisher: Springer Science & Business Media
ISBN: 1441957685
Category : Technology & Engineering
Languages : en
Pages : 562

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Book Description
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

Author: John Hock Lye Pang
Publisher: Springer Science & Business Media
ISBN: 1461404630
Category : Technology & Engineering
Languages : en
Pages : 184

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Book Description
Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests.

Author: Mel Schwartz
Publisher: CRC Press
ISBN: 1420043730
Category : Technology & Engineering
Languages : en
Pages : 556

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Book Description
Explores State-of-the-Art Work from the World's Foremost Scientists, Engineers, Educators, and Practitioners in the FieldWhy use smart materials?Since most smart materials do not add mass, engineers can endow structures with built-in responses to a myriad of contingencies. In their various forms, these materials can adapt to their environments by c

Author: James E. Morris
Publisher: Springer
ISBN: 3319903624
Category : Technology & Engineering
Languages : en
Pages : 1007

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Book Description
This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.

Author: Haleh Ardebili
Publisher: William Andrew
ISBN: 0128119799
Category : Technology & Engineering
Languages : en
Pages : 510

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Book Description
Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. - Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics - Includes coverage of environmentally friendly 'green encapsulants' - Presents coverage of faults and defects, and how to analyze and avoid them