1997 21st International Conference on Microelectronics Proceedings PDF Download
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Author: Publisher: Electron Devices Society ISBN: 9780780336650 Category : Integrated circuits Languages : en Pages : 800
Book Description
The International Conference on Microelectronics (MIEL) is one of the most outstanding European conferences, providing an international forum for the presentation and discussion of the recent development and future trends in the field of microelectronics.
Author: Publisher: Electron Devices Society ISBN: 9780780336650 Category : Integrated circuits Languages : en Pages : 800
Book Description
The International Conference on Microelectronics (MIEL) is one of the most outstanding European conferences, providing an international forum for the presentation and discussion of the recent development and future trends in the field of microelectronics.
Author: Institute of Electrical and Electronics Engineers Yugoslavia Section Electron Devices Chapter Publisher: ISBN: Category : Languages : en Pages : 412
Author: Kenichi Takahata Publisher: BoD – Books on Demand ISBN: 9533070277 Category : Technology & Engineering Languages : en Pages : 528
Book Description
This book discusses key aspects of MEMS technology areas, organized in twenty-seven chapters that present the latest research developments in micro electronic and mechanical systems. The book addresses a wide range of fundamental and practical issues related to MEMS, advanced metal-oxide-semiconductor (MOS) and complementary MOS (CMOS) devices, SoC technology, integrated circuit testing and verification, and other important topics in the field. ?Several chapters cover state-of-the-art microfabrication techniques and materials as enabling technologies for the microsystems. Reliability issues concerning both electronic and mechanical aspects of these devices and systems are also addressed in various chapters.
Author: Publisher: Institute of Electrical & Electronics Engineers(IEEE) ISBN: 9780780337879 Category : Technology & Engineering Languages : en Pages : 379
Book Description
This text on multi-chip modules, covers such topics as: micro/chip scale packaging; low cost MCM-L technology; design and manufacture; markets and infrastructure; flip chip and CSP; interconnect technologies; known good die; and modelling and analysis.
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Author: Institute of Electrical and Electronics Engineers Yugoslavia Section Electron Devices Chapter
Author: International Conference on Microelectronics
Author: Institute of Electrical and Electronics Engineers
Author: Kenichi Takahata
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Author: Rose Arny