Author:
Publisher:
ISBN: 9780780307957
Category : Electronic apparatus and appliances
Languages : en
Pages : 1166
Book Description
1993 Proceedings, 43rd Electronic Components & Technology Conference
Author:
Publisher:
ISBN: 9780780307957
Category : Electronic apparatus and appliances
Languages : en
Pages : 1166
Book Description
Publisher:
ISBN: 9780780307957
Category : Electronic apparatus and appliances
Languages : en
Pages : 1166
Book Description
ECTC '93
Author: IEEE, Components, Hybrids and Manufacturing Technology
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 1160
Book Description
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 1160
Book Description
43rd Electronic Components & Technology Conference 1993
Author:
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages :
Book Description
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages :
Book Description
IEEE Electronic Components and Technology Conference, 43rd, 1993
Special Section of 28 Papers Selected from Those Presented at the 43rd Electronic Components and Technology Conference (ECTC), Held in Orlando, FL, June 1 - 4, 1993
Chip On Board
Author: John H. Lau
Publisher: Springer Science & Business Media
ISBN: 9780442014414
Category : Computers
Languages : en
Pages : 584
Book Description
This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.
Publisher: Springer Science & Business Media
ISBN: 9780442014414
Category : Computers
Languages : en
Pages : 584
Book Description
This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.
Manufacturing Aspects in Electronic Packaging 1993
Author: American Society of Mechanical Engineers. Winter Meeting
Publisher:
ISBN: 9780791810323
Category : Technology & Engineering
Languages : en
Pages : 144
Book Description
Publisher:
ISBN: 9780791810323
Category : Technology & Engineering
Languages : en
Pages : 144
Book Description
Proceedings
Author:
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 1220
Book Description
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 1220
Book Description
Electrical & Electronics Abstracts
Author:
Publisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 2092
Book Description
Publisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 2092
Book Description
Computer Integrated Manufacturing - Proceedings Of The 3rd International Conference (In 2 Volumes)
Author: Robert Gay
Publisher: World Scientific
ISBN: 9814548790
Category :
Languages : en
Pages : 1596
Book Description
Publisher: World Scientific
ISBN: 9814548790
Category :
Languages : en
Pages : 1596
Book Description