Author: Publisher:
ISBN:
Category :
Languages : en
Pages : 616
Book Description
Future Energy Conferences and Symposia
Author: ASME Proceedings of the 1988 National Heat Transfer Conference : HTD 96
Author: Progress In Astronautics and Aeronautics
Author: A. A. BorisovPublisher: AIAA
ISBN: 9781600863882
Category : Explosions
Languages : en
Pages : 450
Book Description
Journal of Heat Transfer
Author: Nuclear Safety
Author: Annual IEEE Semiconductor Thermal Measurement and Management Symposium
Author: Publisher:
ISBN:
Category : Amorphous semiconductors
Languages : en
Pages : 284
Book Description
AIChE Symposium Series
Author: American Institute of Chemical EngineersPublisher:
ISBN:
Category : Chemical engineering
Languages : en
Pages : 858
Book Description
New Polymer Technology for Auto Body Exteriors
Author: W. R. SchmealPublisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 690
Book Description
Publications Bulletin
Author: Commission of the European Communities. Joint Research Centre. Ispra EstablishmentPublisher:
ISBN:
Category : Nuclear energy
Languages : en
Pages : 502
Book Description
Microscale Heat Transfer - Fundamentals and Applications
Author: S. KakaçPublisher: Springer Science & Business Media
ISBN: 1402033613
Category : Technology & Engineering
Languages : en
Pages : 517
Book Description
This volume contains an archival record of the NATO Advanced Institute on Microscale Heat Transfer – Fundamental and Applications in Biological and Microelectromechanical Systems held in Çesme – Izmir, Turkey, July 18–30, 2004. The ASIs are intended to be high-level teaching activity in scientific and technical areas of current concern. In this volume, the reader may find interesting chapters and various Microscale Heat Transfer Fundamental and Applications. The growing use of electronics, in both military and civilian applications has led to the widespread recognition for need of thermal packaging and management. The use of higher densities and frequencies in microelectronic circuits for computers are increasing day by day. They require effective cooling due to heat generated that is to be dissipated from a relatively low surface area. Hence, the development of efficient cooling techniques for integrated circuit chips is one of the important contemporary applications of Microscale Heat Transfer which has received much attention for cooling of high power electronics and applications in biomechanical and aerospace industries. Microelectromechanical systems are subject of increasing active research in a widening field of discipline. These topics and others are the main themeof this Institute.