Author:
Publisher:
ISBN:
Category : Electric connectors
Languages : en
Pages : 448
Book Description
Annual Connectors and Interconnection Technology Symposium Proceedings
Annual Connector & Interconnection Technology Symposium
Electrical & Electronics Abstracts
Author:
Publisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 1722
Book Description
Publisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 1722
Book Description
Electrical Contacts
Author: Paul G. Slade
Publisher: CRC Press
ISBN: 9780824719340
Category : Technology & Engineering
Languages : en
Pages : 1116
Book Description
Covering the choice, attachment, and testing of contact materials, Electrical Contacts introduces a thorough discussion on making electric contact and contact interface conduction, presents a general outline of, and measurement techniques for, important corrosion mechanisms, discusses the results of contact wear when plug-in connections are made and broken, investigates the effect of thin noble metal plating on electronic connections, relates crucial considerations for making high- and low-power contact joints, details arcing effects on contacts including contact erosion, welding, and contamination, and contains nearly 2800 references, tables, equations, drawings, and photographs.
Publisher: CRC Press
ISBN: 9780824719340
Category : Technology & Engineering
Languages : en
Pages : 1116
Book Description
Covering the choice, attachment, and testing of contact materials, Electrical Contacts introduces a thorough discussion on making electric contact and contact interface conduction, presents a general outline of, and measurement techniques for, important corrosion mechanisms, discusses the results of contact wear when plug-in connections are made and broken, investigates the effect of thin noble metal plating on electronic connections, relates crucial considerations for making high- and low-power contact joints, details arcing effects on contacts including contact erosion, welding, and contamination, and contains nearly 2800 references, tables, equations, drawings, and photographs.
Electrochemical Technology
Author: Tetsuya Osaka
Publisher: CRC Press
ISBN: 9789056990022
Category : Science
Languages : en
Pages : 658
Book Description
The electronics industry underwent a rapid evolution from thick to thin films during the last decade. Electrochemical technology played an important and often decisive role in the direction of this evolution. Applications include plating through mask technology, plating for thin film heads, plating for high density magnetic thin film, selective etching technology, etc. New electrochemical approaches have also been developed which will play key roles in the electronics industry. This book reports on the latest progress in electrochemical processes, including fundamentals and applications. Additional volumes dealing with more specific applications of electrochemistry are also planned.
Publisher: CRC Press
ISBN: 9789056990022
Category : Science
Languages : en
Pages : 658
Book Description
The electronics industry underwent a rapid evolution from thick to thin films during the last decade. Electrochemical technology played an important and often decisive role in the direction of this evolution. Applications include plating through mask technology, plating for thin film heads, plating for high density magnetic thin film, selective etching technology, etc. New electrochemical approaches have also been developed which will play key roles in the electronics industry. This book reports on the latest progress in electrochemical processes, including fundamentals and applications. Additional volumes dealing with more specific applications of electrochemistry are also planned.
Microelectronics Packaging Handbook
Author: Rao Tummala
Publisher: Springer Science & Business Media
ISBN: 9780412084515
Category : Computers
Languages : en
Pages : 662
Book Description
This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.
Publisher: Springer Science & Business Media
ISBN: 9780412084515
Category : Computers
Languages : en
Pages : 662
Book Description
This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.
Index of Conference Proceedings
Author:
Publisher:
ISBN:
Category : Conference proceedings
Languages : en
Pages : 832
Book Description
Publisher:
ISBN:
Category : Conference proceedings
Languages : en
Pages : 832
Book Description
Conference Proceedings
Author: Society of Plastics Engineers. Technical Conference
Publisher:
ISBN:
Category : Plastics
Languages : en
Pages : 588
Book Description
Publisher:
ISBN:
Category : Plastics
Languages : en
Pages : 588
Book Description
New Serial Titles
Author:
Publisher:
ISBN:
Category : Periodicals
Languages : en
Pages : 1768
Book Description
A union list of serials commencing publication after Dec. 31, 1949.
Publisher:
ISBN:
Category : Periodicals
Languages : en
Pages : 1768
Book Description
A union list of serials commencing publication after Dec. 31, 1949.
Proceedings of the Symposium on Electrochemical Technology in Electronics
Author: Lubomyr Taras Romankiw
Publisher:
ISBN:
Category : Electrochemistry, Industrial
Languages : en
Pages : 832
Book Description
Publisher:
ISBN:
Category : Electrochemistry, Industrial
Languages : en
Pages : 832
Book Description